DUAL SEGMENT MOLDED LEAD FRAME CONNECTOR FOR OPTICAL TRANSCEIVER MODULES

Title:

DUAL SEGMENT MOLDED LEAD FRAME CONNECTOR FOR OPTICAL TRANSCEIVER MODULES

Document Type and Number:

WIPO Patent Application WO2005084259

Kind Code:

A3

Abstract:

The present invention illustrates lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors (102) include a stamped and bent conductive lead structure (110) that is encased in a plurality of insert injection molded plastic casings (112, 114). The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

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Inventors:

ICE DONALD A (US)
DOUMA DARIN JAMES (US)

Application Number:

PCT/US2005/006366

Publication Date:

March 30, 2006

Filing Date:

February 28, 2005

Export Citation:

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Assignee:

FINISAR CORP (US)
ICE DONALD A (US)
DOUMA DARIN JAMES (US)

International Classes:

G02B6/42; H01R12/71; H05K3/34; H05K1/14; H05K3/20; (IPC1-7): H01R12/00

Foreign References:

US6368158B1	2002-04-09
US6068523A	2000-05-30

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