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Patent Searching and Data


Title:
EASILY CRUSHABLE DIAMOND ABRASIVE GRAINS AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/066172
Kind Code:
A1
Abstract:
[Problem] To provide: abrasive grains which have all of the function of fine cracks formed in diamond abrasive grains and the function of an irregular shape of the surface of the abrasive grains or further have the function of a non-diamond carbon layer that covers the surface of the abrasive grains complexly; and a method for manufacturing the abrasive grains. [Solution] Diamond abrasive grains according to the present invention comprise diamond particles synthesized by a static high-pressure high-temperature method, have heating-induced fine cracks in the particles and also have depressions and protrusions formed by oxidative etching under a high temperature on the surfaces of the particles, and have improved friability. A method for manufacturing diamond abrasive grains according to the present invention comprises: subjecting starting material diamond particles which have been synthesized by a static high-pressure high-temperature method to a heating treatment at a heating temperature of 800℃ or higher while bringing the diamond particles into close contact with an oxidative etching agent to cause the formation of fine cracks in the diamond particles; and eroding the surfaces of the particles to collect the resultant product as treated diamond having a rugged surface.

Inventors:
ISHIZUKA YOSHIAKI
ISHIZUKA Yoshiaki (JP)
Application Number:
PCT/JP2020/037635
Publication Date:
April 08, 2021
Filing Date:
October 02, 2020
Export Citation:
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Assignee:
ISHIZUKA SHOKO (JP)
International Classes:
C09K3/14; B24D3/00; C01B32/28
Attorney, Agent or Firm:
HAMANO Takao et al. (JP)
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