EDGE-REMOVING MACHINING METHOD FOR WAFER CHIP, AND SCRIBING MACHINE USING SAME

WIPO Patent Application WO/2021/208440

A1

An edge-removing machining method for a wafer chip, and a scribing machine using same. Said method comprises: defining the backside outer edge of a wafer chip (4) as a wafer chip outer edge ring (4b) to be removed; calculating and generating, by a visual alignment system of a scribing machine and on the basis of point position coordinates of the wafer chip outer edge ring (4b), an circular cutting track corresponding to the wafer chip outer edge ring (4b); using the circular cutting track as a target cutting track, and finally performing edge-removing cutting on the wafer chip (4) by a cutting tool of the scribing machine and according to the target cutting track; finally separating the backside outer edge of the wafer chip (4) from the wafer chip (4). The whole edge-removing machining process is convenient and efficient, and after the wafer chip for which edge-removing machining has been completed enters a normal scribing and cutting process, the phenomenon of carry-over in the scribing and cutting process is reliably avoided.

JP7138452	Flange mechanism
JP2016203501	SCRIBE DEVICE AND SCRIBE METHOD

YANG YUNLONG (CN)
JIANG SU (CN)
GAO JINLONG (CN)
YU GUANGMING (CN)

PCT/CN2020/130730

October 21, 2021

November 23, 2020

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JIANGSU JCA ELECTRONIC TECH CO LTD (CN)

B28D5/02; H01L21/67; H01L21/683

CN111633852A	2020-09-08
CN1509495A	2004-06-30
CN110323183A	2019-10-11
JP2008288237A	2008-11-27
CN206619587U	2017-11-07
CN108766927A	2018-11-06
US20170294300A1	2017-10-12
CN110729178A	2020-01-24

CHANGZHOU BAIYETENGFEI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)

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