Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/241681
Kind Code:
A1
Abstract:
Provided is an elastic wave device which has increased adhesion between layers of a piezoelectric substrate and in which delamination of layers is less likely to occur. An elastic wave device 1 comprises: a support substrate 3; a low acoustic velocity film 5 layered on the support substrate 3; a piezoelectric body layer 6 layered on the low acoustic velocity film 5; an IDT electrode 8 provided on the piezoelectric body layer 6; and a high acoustic velocity film 4 disposed between the support substrate 3 and the low acoustic velocity film 5. The acoustic velocity of a bulk wave propagating in the low acoustic velocity film 5 is lower than the acoustic velocity of a bulk wave propagating in the piezoelectric body layer 6. The acoustic velocity of a bulk wave propagating in the high acoustic velocity film 4 is higher than the acoustic velocity of an elastic wave propagating in the piezoelectric body layer 6. The adhesion between the low acoustic velocity film 5 and the support substrate 3 is higher than the adhesion between the high acoustic velocity film 4 and the support substrate 3. The high acoustic velocity film 4 is disposed partially between the support substrate 3 and the low acoustic velocity film 5 so that a part of the low acoustic velocity film 5 and a part of the support substrate 3 are in contact with each other.
Inventors:
MICHIGAMI AKIRA (JP)
Application Number:
PCT/JP2021/020184
Publication Date:
December 02, 2021
Filing Date:
May 27, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2017013968A1 | 2017-01-26 | |||
| WO2016185772A1 | 2016-11-24 | |||
| WO2019198594A1 | 2019-10-17 | |||
| WO2019181087A1 | 2019-09-26 |
Foreign References:
| CN110601674A | 2019-12-20 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Download PDF:
Previous Patent: ULTRA-THIN FILM OF THERMOSETTING RESIN
Next Patent: RESIN COMPOSITION AND MOLDED BODY
Next Patent: RESIN COMPOSITION AND MOLDED BODY