ELECTRICAL CONNECTOR, AND SOCKET FOR ELECTRIC COMPONENT

Title:

ELECTRICAL CONNECTOR, AND SOCKET FOR ELECTRIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2014/148365

Kind Code:

A1

Abstract:

In the present invention, a socket body, in which an IC package is accommodated, is provided with contact pins, and the contact pins make electrical contact with connection terminals of the accommodated IC package. The contact pins are formed by laminating a plurality of layers, each formed by layering the following, in order, on a conductive substrate: an underlayer containing Ni; and a surface layer. The surface layer is formed from a first layer on the underlayer side thereof, and a second layer in contact with a connection terminal of the IC package. The first layer is formed from a plated layer in which a Pd-Ni alloy is the main component, the layer being a material into which Sn is merged and diffused by heating, and in which the diffusion rate of Sn is slower than Pd. The second layer is formed from a plated layer in which Ag is the main component, the layer being a material in which the diffusion rate of Sn is slower than the first layer.

Inventors:

ODA TAKAHIRO (JP)

Application Number:

PCT/JP2014/056788

Publication Date:

September 25, 2014

Filing Date:

March 13, 2014

Export Citation:

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Assignee:

ENPLAS CORP (JP)

International Classes:

H01R33/76; H01R13/03

Domestic Patent References:

WO2008123260A1	2008-10-16
WO2014003003A1	2014-01-03
WO2011112939A1	2011-09-15
WO2007034921A1	2007-03-29

Foreign References:

JPS59180908A	1984-10-15
JP2012230117A	2012-11-22
JPS6037605A	1985-02-27

Other References: