Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRICAL CONTACTING METHOD AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/145955
Kind Code:
A3
Abstract:
In a method for electrically contacting a component (10) (e.g. a substrate) with at least one electrical contact (30), an open-cell contact layer is additively formed on the at least one contact (30), in particular using a nozzle (55). The contact layer can be in tangled form (160), a folded weave (wire) (260) or foam crumbs (360) which are left behind after the evaporation of a carrier liquid (355) from a paste applied to the component (10), said paste comprising particles (of a mixture of granular material (360) in the form of foam crumbs (360) and the carrier liquid (355)). The contact layer can be then electrically contacted with the contact (30) by electroplating (especially electrochemically or without external current). A power module (50) can have a cooling channel in which a power component is provided together with the contact layer used to contact said component, and a cooling fluid, in particular a coolant liquid or coolant gas can flow through the cooling channel.

Inventors:
BAUEREGGER HUBERT (DE)
DONAT ALBRECHT (DE)
KASPAR MICHAEL (DE)
KRIEGEL KAI (DE)
MITIC GERHARD (DE)
SCHWARZ MARKUS (DE)
SCHWARZBAUER HERBERT (DE)
STEGMEIER STEFAN (DE)
WEIDNER KARL (DE)
ZAPF JÖRG (DE)
Application Number:
PCT/EP2018/052292
Publication Date:
November 29, 2018
Filing Date:
January 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SIEMENS AG (DE)
International Classes:
H01L21/60; H01L23/467; H01L23/473; H01L23/488
Domestic Patent References:
WO2006068643A12006-06-29
WO2016193038A12016-12-08
Foreign References:
EP2775511A12014-09-10
US20100328896A12010-12-30
US20060279932A12006-12-14
EP1198001A22002-04-17
DE102009003294A12010-11-25
DE102004048529A12005-05-25
EP2270852A22011-01-05
US20160225730A12016-08-04
Download PDF: