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Patent Searching and Data


Title:
ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE FILM AND PREPARATION METHOD AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/001952
Kind Code:
A1
Abstract:
An electrically and thermally conductive adhesive film and a preparation method and an application thereof. The adhesive film comprises an adhesive matrix and a metal mesh; the metal mesh is embedded into the adhesive matrix, and the length, width, and height of the metal mesh are same as the length, width, and height of the whole adhesive film. The adhesive film is used for bonding materials to be bonded at two sides, and achieves the functions such as electrical conduction and thermal conduction. The continuous metal mesh is used, the adhesive film can obtain higher electrical conductivity, thermal conductivity, and bonding strength, reduce the volume and content of a filler, and can ensure structural consistence of the adhesive film.

Inventors:
HUANG GUIWEN (CN)
XIAO HONGMEI (CN)
LIU YU (CN)
QU CHENGBING (CN)
LI NA (CN)
Application Number:
PCT/CN2021/102744
Publication Date:
January 06, 2022
Filing Date:
June 28, 2021
Export Citation:
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Assignee:
THE TECHNICAL INST OF PHYSICS AND CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN)
International Classes:
B32B15/08; B32B3/24; B32B5/18; B32B15/04; H01B1/20
Domestic Patent References:
WO2020067837A12020-04-02
Foreign References:
CN109291575A2019-02-01
CN109943023A2019-06-28
US20120175534A12012-07-12
KR101552425B12015-09-10
Attorney, Agent or Firm:
BEIJING ORIGINTELLIGENCE IP LAW FIRM (CN)
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