Title:
ELECTROCHEMICAL-MECHANICAL POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO2005123336
Kind Code:
A3
Abstract:
Provided is a polishing apparatus (100) and polishing pad (104), intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided having first and second pluralities of unidirectional pores (146, 148) configured to communicate polishing composition between the top and bottom surfaces of the pad. A cyclic flow of composition is established to continuously renew composition to the area of interaction between the pad and the substrate. In another aspect, a polishing apparatus is provided having a polishing composition transfer region between a polishing pad and a platen. Pores disposed through the pad communicate composition from the transfer region to the top surface. To facilitate directing the composition into the pores, the apparatus includes a plurality of protrusions protruding into the transfer region that are aligned with the pores.
Inventors:
WYLIE IAN (US)
ANJUR SRIRAM (US)
ANJUR SRIRAM (US)
Application Number:
PCT/US2005/020400
Publication Date:
March 02, 2006
Filing Date:
June 09, 2005
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
B24D13/14; B24B37/04
Domestic Patent References:
| WO2000012264A1 | 2000-03-09 |
Foreign References:
| US5725420A | 1998-03-10 |
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