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Title:
ELECTROCONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/216739
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electroconductive film composition which is excellent in terms of solderability, screen printability, low resistance, adhesion to substrates, and storage stability. The electroconductive composition of the present invention comprises electroconductive particles, an epoxy resin A which has an epoxy equivalent less than 500 g/eq and is liquid at 25°C, an epoxy resin B which has an epoxy equivalent of 400-5,000 g/eq and is solid at 25°C, a thermoplastic resin C having a weight-average molecular weight of 25,000-65,000, a hardener D, and a solvent, the total amount of the components A, B, C, and D being 3-10 parts by mass per 100 parts by mass of the electroconductive particles, the mass ratio of the sum of the components A and B to the content of the component C, (A+B)/C, being 50/50 to 95/5, the mass ratio of the content of the component A to the sum of the components B and C, A/(B+C), being 15/85 to 85/15, and the mass ratio of the component D to the sum of the components A and B, D/(A+B), being 2/98 to 10/90. The electroconductive composition contains substantially no metal carboxylate.

Inventors:
ARAKAWA KAZUO (JP)
SAIKI TAKEAKI (JP)
ISHIKAWA KAZUNORI (JP)
Application Number:
PCT/JP2018/019876
Publication Date:
November 29, 2018
Filing Date:
May 23, 2018
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD (JP)
International Classes:
C08L63/00; C08K3/08; C08L101/00; H01B1/22
Domestic Patent References:
WO2016006467A12016-01-14
WO2016021535A12016-02-11
WO2016017618A12016-02-04
Foreign References:
JP2016160413A2016-09-05
JP2016160415A2016-09-05
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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