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Patent Searching and Data


Title:
ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/158450
Kind Code:
A1
Abstract:
This electroconductive member 1 comprises an adhesive layer 10 and a metal foil layer 20. The adhesive layer 10 comprises an adhesive composition 14 that includes electroconductive particles 12. The metal foil layer 20 is positioned on the adhesive layer 10. This electroconductive member 1 can be used, for example, to form a prescribed metal film.

Inventors:
OKOSHI MASASHI (JP)
TAKANO NOZOMU (JP)
FUJIMOTO DAISUKE (JP)
IZAWA HIROYUKI (JP)
KOTAKE TOMOHIKO (JP)
AKAI KUNIHIKO (JP)
ITOH YUKA (JP)
TAKAGI SHUNSUKE (JP)
Application Number:
PCT/JP2022/001615
Publication Date:
July 28, 2022
Filing Date:
January 18, 2022
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/00; H01L21/56; H01L23/28
Domestic Patent References:
WO2018181761A12018-10-04
WO2020100345A12020-05-22
Foreign References:
JP2017147448A2017-08-24
JP2020088373A2020-06-04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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