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Title:
ELECTROCONDUCTIVE MULTILAYER BODY AND METHOD FOR PRODUCING ELECTROCONDUCTIVE MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2022/071300
Kind Code:
A1
Abstract:
An electroconductive multilayer body which comprises a base material and an electroconductive ink film that is arranged on the base material, wherein: if a surface of the electroconductive ink film closer to the base material is taken as the first main surface, and a surface thereof further from the base material is taken as the second main surface, the first void fraction in the region from the first main surface to 50% of the thickness toward the second main surface is from 15% to 50%; and the second void fraction in the region from the second main surface to 10% of the thickness toward the first main surface is lower than the first void fraction. A method for producing an electroconductive multilayer body.

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Inventors:
MAEDA KOTARO (JP)
SHIMOHARA NORIHIDE (JP)
Application Number:
PCT/JP2021/035589
Publication Date:
April 07, 2022
Filing Date:
September 28, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B05D1/38; B05D3/02; B05D5/12; B05D7/24; B32B3/24; B32B7/025; B32B15/00; C09D11/322; C09D11/52; H01B5/14; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
WO2012026033A12012-03-01
Foreign References:
JP2007286152A2007-11-01
JP2015514265A2015-05-18
JP2018041939A2018-03-15
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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