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Patent Searching and Data


Title:
ELECTRODE PATTERN INTEGRATED MOLDING AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/212832
Kind Code:
A1
Abstract:
[Problem] To provide an electrode pattern integrated molding and a method for manufacturing the same that are capable of securely fixing, onto an inner surface of a resin molding, a band-like second film having an electric connection part with an external substrate. [Solution] Provided are the following: a resin molding; a first film 11 formed on an inner surface of the resin molding and having an electrode pattern 13 and first lead-out wiring 63 electrically connected to the electrode pattern 13; and a band-like second film 4 rising from the inner surface of the resin molding and having second lead-out wiring 15 electrically connected to the first lead-out wiring. The resin molding contains a pair of support wall parts 3 integrally rising from the inner surface of the resin molding so as to clamp and hold both ends of a base part 4a of the second film.

Inventors:
YAMAZAKI SEIICHI (JP)
IGA TOSHIHIRO (JP)
TAKINISHI YASUISA (JP)
Application Number:
PCT/JP2017/017148
Publication Date:
December 14, 2017
Filing Date:
May 01, 2017
Export Citation:
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Assignee:
NISSHA CO LTD (JP)
International Classes:
B29C45/14; B29C33/14; H05K7/14
Foreign References:
JP2012011691A2012-01-19
JPS6399558A1988-04-30
JP2010182773A2010-08-19
JPH0361372U1991-06-17
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