Title:
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2019/239909
Kind Code:
A1
Abstract:
Provided are an electronic circuit connection method and an electronic circuit capable of improving the reliability of an electrical connection. Provided is a connection method for an electronic circuit 100, comprising a step for forming a first metal bump 30 and a second metal bump 40 each having a cone shape, and a step for joining a first electrode pad 12 and a third electrode pad 22 through the first metal bump 30 and joining a second electrode pad 13 and a fourth electrode pad 23 through the second metal bump 40, wherein: a level difference 11c is provided at least between a first region 11a and a second region 11b of a first connection surface 11 or between a third region 21a and a fourth region 21b of a second connection surface 21; and the first metal bump 30 and the second metal bump 40 have different heights so as to compensate for a height H1 of the level difference 11c.
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Inventors:
HASHINO MASARU (JP)
LIM YING YING (JP)
NAKAGAWA HIROSHI (JP)
AOYAGI MASAHIRO (JP)
KIKUCHI KATSUYA (JP)
LIM YING YING (JP)
NAKAGAWA HIROSHI (JP)
AOYAGI MASAHIRO (JP)
KIKUCHI KATSUYA (JP)
Application Number:
PCT/JP2019/021519
Publication Date:
December 19, 2019
Filing Date:
May 30, 2019
Export Citation:
Assignee:
AIST (JP)
International Classes:
H01L21/60
Domestic Patent References:
WO2014136241A1 | 2014-09-12 | |||
WO2007114314A1 | 2007-10-11 |
Foreign References:
JP2015057813A | 2015-03-26 | |||
JP2002139547A | 2002-05-17 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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