Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURE OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/010164
Kind Code:
A1
Abstract:
An electronic component (100) comprises: a substrate (110); functional elements (120) formed on the substrate (110); columnar conductors (140) protruding from the substrate (100); a cover part (130) which is supported by the columnar conductors (140); a sealing member (160) which covers the substrate (110); and external terminals (180) which electrically connect to an external device. A hollow space (150) is formed by the substrate (110), the cover part (130), and the sealing member (160). The columnar conductors (140) pass through the cover part (130) and electrically connect to the external terminals (180). The surface of the substrate (110) on which the functional elements (120) are formed faces the hollow space (150).
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Inventors:
SOMADA HIROSHI (JP)
Application Number:
PCT/JP2020/025797
Publication Date:
January 21, 2021
Filing Date:
July 01, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/15; H03H3/08; H03H9/25
Domestic Patent References:
WO2013121866A1 | 2013-08-22 | |||
WO2016158050A1 | 2016-10-06 |
Foreign References:
JP2008271354A | 2008-11-06 | |||
JP2013048489A | 2013-03-07 | |||
JP2013051518A | 2013-03-14 | |||
JP2009232172A | 2009-10-08 | |||
JP2005536879A | 2005-12-02 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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