Title:
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO2004075254
Kind Code:
A3
Abstract:
An electronic component includes an electronic chip (110) and a chip carrier portion (120) having sidewalls (121) and a bottom portion (122). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component.
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Inventors:
JOHNSON GARY (US)
Application Number:
PCT/US2004/003100
Publication Date:
December 01, 2005
Filing Date:
February 04, 2004
Export Citation:
Assignee:
FREESCALE SEMICONDUCTOR INC (US)
JOHNSON GARY (US)
JOHNSON GARY (US)
International Classes:
H01L23/495; H01L23/552; (IPC1-7): H01L23/28; H01L23/04
Foreign References:
| US6777819B2 | 2004-08-17 |
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