Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/100505
Kind Code:
A1
Abstract:
An electronic component (100) is provided with a substrate (110), a functional element (120) formed on the substrate (110), a support (140), and a cover portion (170). The support (140) is disposed over the substrate (100) around a region in which the functional element (120) is formed. The cover portion (170) is disposed to oppose the substrate (110) and, together with the substrate (100) and the support (140), forms a hollow space (180). The cover portion (170) has a shape protruding in a direction opposite to the hollow space (180).
Inventors:
INOUE KAZUNORI (JP)
OTSUKA SHINTARO (JP)
FUKUSHIMA MASAHIRO (JP)
OTSUKA SHINTARO (JP)
FUKUSHIMA MASAHIRO (JP)
Application Number:
PCT/JP2020/041646
Publication Date:
May 27, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H03H3/08; H03H9/25
Domestic Patent References:
| WO2016158744A1 | 2016-10-06 |
Foreign References:
| JP2018117267A | 2018-07-26 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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