Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/261061
Kind Code:
A1
Abstract:
This electronic component comprises: an insulating substrate having a first main surface and a second main surface that is the opposite surface to the first main surface; a first pad formed on the first main surface; a second pad that is formed on the first main surface and is spaced apart from the first pad; an element that is mounted on the first pad and is electrically connected to the second pad; and a sealing resin that is disposed on the first main surface and seals the element. In the first main surface, a groove extending so as to reach an end of the substrate is formed. At least a part of the groove has, in a cross-section in a direction perpendicular to the first main surface and crossing the extension direction of the groove, a first width on the same surface as the first main surface, and a second width greater than the first width at a position deeper than the first main surface. The groove is filled with the sealing resin.
Inventors:
OKAZAKI TADAHIRO (JP)
Application Number:
PCT/JP2021/015717
Publication Date:
December 30, 2021
Filing Date:
April 16, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L33/52; H01L23/12; H01L33/62
Foreign References:
| JPH01283883A | 1989-11-15 | |||
| JP2010027974A | 2010-02-04 | |||
| JP2013058739A | 2013-03-28 | |||
| JP2004207363A | 2004-07-22 | |||
| JP2019046932A | 2019-03-22 | |||
| US20180013041A1 | 2018-01-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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