ELECTRONIC COMPONENT MODULE AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT MODULE

WIPO Patent Application WO/2021/049400

A1

An electronic component module (10) that comprises a substrate (20), a mounting-type electronic component (41), a mounting-type electronic component (42), an insulating resin (51), and an insulating resin (52). Mounting-type electronic component (41) is mounted on a first principal surface (201) of the substrate (20). Mounting-type electronic component (42) is mounted on a second principal surface (202) of the substrate (20). Insulating resin (51) covers the first principal surface (201) side. Insulating resin (52) covers the second principal surface (202) side. Mounting-type electronic component (41) uses a semiconductor substrate. A top surface (412) of the semiconductor substrate that is on the opposite side of mounting-type electronic component (41) from the first principal surface (201) is exposed from insulating resin (51). Printing (80) is provided on the top surface (412), i.e., the exposed surface, of the semiconductor substrate.

JP4512027	Manufacturing method of semiconductor package
JPS61248448	SEMICONDUCTOR DEVICE

OKABE RYOHEI (JP)

PCT/JP2020/033361

March 18, 2021

September 03, 2020

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MURATA MANUFACTURING CO (JP)

H01L23/00; H01L23/12; H01L25/00; H05K9/00

WO2016181706A1	2016-11-17
WO2019045088A1	2019-03-07
WO2018198856A1	2018-11-01

JP2005203695A	2005-07-28
JP2001085285A	2001-03-30
JP2018195756A	2018-12-06
JP2013074218A	2013-04-22

KAEDE PATENT ATTORNEYS' OFFICE (JP)

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