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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT MOUNTING METHOD, AND LED DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2021/010079
Kind Code:
A1
Abstract:
The present invention pertains to an electronic component mounting structure for mounting chip-type LED chips 3 on one surface of a wiring substrate 1. The LED chips 3 are each provided with a pair of electrode parts 30 each having a recess in the surface thereof. The wiring substrate 1 is provided with: salient bump electrodes 4 which are connected to the respective recesses of the electrode parts 30; and fixing members 2, the position of which is determined in accordance with the arrangement of said bump electrodes 4 and which is for fixing the LED chips 3. The bump electrodes 4 are joined face-to-face with the respective recesses of the electrode parts. The LED chips 3 are fixed to the wiring substrate 1 via the fixing members 2. With this configuration, it is possible to improve the mounting yield of the LED chips 3.

Inventors:
NISHIMURA HIDEYUKI (JP)
FUKAYA KOICHIRO (JP)
YANAGAWA YOSHIKATSU (JP)
OKURA NAOYA (JP)
Application Number:
JP2020/023622
Publication Date:
January 21, 2021
Filing Date:
June 16, 2020
Export Citation:
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Assignee:
V TECH CO LTD (JP)
International Classes:
H01L23/12; G09F9/33; H01L21/60; H01L33/62
Foreign References:
JP2008130992A2008-06-05
JP2016157773A2016-09-01
JP2010103397A2010-05-06
JP2016167544A2016-09-15
JP2013207183A2013-10-07
Attorney, Agent or Firm:
OGAWA, Moriaki et al. (JP)
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