Title:
ELECTRONIC COMPONENT PACKAGING COVER TAPE AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/187519
Kind Code:
A1
Abstract:
The present disclosure provides an electronic component packaging cover tape having a substrate layer, a heat seal layer disposed on one surface side of the substrate layer, and an antistatic layer disposed on the opposite surface side of the substrate layer from the heat seal layer. The electronic component packaging cover tape has a surface resistivity of 1x1010Ω/ or lower when measured from the antistatic layer side of the cover tape after the cover tape is stored in a state of a package using a carrier tape while being subjected to humidity and heat under a 60˚C and 95% RH environment for 24 hours, and a surface tack force of 5 gf or lower when measured from the heat seal layer side of the cover tape after the cover tape is stored in the state of the package using the carrier tape while being subjected to humidity and heat under the 60˚C and 95% RH environment for 24 hours.
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Inventors:
NAGATSUKA YASUNORI (JP)
YANAGISAWA SHUNPEI (JP)
INOUE MASAKUNI (JP)
YANAGISAWA SHUNPEI (JP)
INOUE MASAKUNI (JP)
Application Number:
PCT/JP2021/010788
Publication Date:
September 23, 2021
Filing Date:
March 17, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B65D75/34; B32B7/022; B32B7/025
Foreign References:
JP2018127256A | 2018-08-16 | |||
JP2019043032A | 2019-03-22 | |||
JP2008280365A | 2008-11-20 | |||
JP2019156405A | 2019-09-19 |
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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