Title:
ELECTRONIC COMPONENT PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/070782
Kind Code:
A1
Abstract:
This electronic component processing device is provided with: a sheet holding unit for holding a sheet having an affixing surface to which an electronic component is affixed; a plurality of suction-attachment portions arranged along a circular trajectory passing through a suction-attachment region; a turning unit holding the plurality of suction-attachment portions; a turning drive unit for turning the turning unit; a projecting unit for projecting the sheet toward the suction-attachment region; a sheet position adjusting unit for modifying the position of the sheet holding unit in a direction along the affixing surface; and a projecting position adjusting unit for modifying the position of the projecting unit in the direction along the affixing surface.
Inventors:
OOBA KAZUYA (JP)
Application Number:
PCT/JP2020/037743
Publication Date:
April 15, 2021
Filing Date:
October 05, 2020
Export Citation:
Assignee:
UENO SEIKI CO LTD (JP)
International Classes:
H01L21/677; H01L21/67; H01L21/68
Domestic Patent References:
| WO2015083221A1 | 2015-06-11 | |||
| WO2017098980A1 | 2017-06-15 | |||
| WO2011125115A1 | 2011-10-13 |
Foreign References:
| JP2012119494A | 2012-06-21 | |||
| JP2015121456A | 2015-07-02 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
Download PDF: