Title:
ELECTRONIC COMPONENT PROCESSING FILM AND ELECTRONIC COMPONENT PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/033715
Kind Code:
A1
Abstract:
An electronic component processing film comprising an adhesive layer and a substrate layer, the electronic component processing film satisfying at least one of the following (1), (2), and (3). (1) The adhesive layer includes a terephthalic acid ester, and the substrate layer includes a reaction product of an aliphatic dicarboxylic acid and glycol. (2) The tack force is 40 gf or higher, and the SUS adhesive force s 1.1 N/25 mm or higher. (3) The thickness of the adhesive layer is 12 μm or greater.
Inventors:
NAKASHIMA SAKI (JP)
YANAGITA YUKI (JP)
YANAGITA YUKI (JP)
Application Number:
PCT/JP2020/031273
Publication Date:
February 25, 2021
Filing Date:
August 19, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B27/00; B32B7/022; B32B27/18; B32B27/30; C09J7/22; C09J7/24; C09J7/38; C09J133/00; C09J201/00; H01L21/301; H01L21/683
Foreign References:
| JP2017132940A | 2017-08-03 | |||
| JP2001019916A | 2001-01-23 | |||
| JP2019152301A | 2019-09-12 | |||
| JP2019152302A | 2019-09-12 |
Other References:
See also references of EP 4019245A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
Previous Patent: DRAWING DEVICE AND DEFLECTOR
Next Patent: AGENT FOR CONTROLLING SCALD DISEASE AND METHOD FOR CONTROLLING SCALD DISEASE
Next Patent: AGENT FOR CONTROLLING SCALD DISEASE AND METHOD FOR CONTROLLING SCALD DISEASE