Title:
ELECTRONIC COMPONENT SEPARATION DEVICE AND ELECTRONIC COMPONENT SEPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/139465
Kind Code:
A1
Abstract:
The present invention provides an electronic component separation device 1 and an electronic component separation method, configured so that heating efficiency is good, and an electronic component can be easily separated from a printed substrate without requiring complex machinery such as vibratory equipment. The electronic component separation device 1 comprises: a conveying unit 2 that conveys a printed substrate 10 to which an electronic component EP is attached; a heating unit 3 that heats the printed substrate 10 during conveying by the conveying unit 2; and a separating unit 4 that causes the printed substrate 10 to drop onto a dropping surface 6 below the conveying unit 2 from the conveying unit 2 during heating or after heating, and that separates the electronic component EP from the printed substrate 10.
Inventors:
KOMORI YUJI (JP)
INOUE EIJI (JP)
INOUE NOBUHIRO (JP)
KONISHI MASAKAZU (JP)
INOUE EIJI (JP)
INOUE NOBUHIRO (JP)
KONISHI MASAKAZU (JP)
Application Number:
PCT/JP2018/002024
Publication Date:
August 02, 2018
Filing Date:
January 23, 2018
Export Citation:
Assignee:
ASTEC IRIE CO LTD (JP)
International Classes:
H05K3/34; B09B3/00; B09B5/00
Domestic Patent References:
| WO2013111206A1 | 2013-08-01 | |||
| WO2007077594A1 | 2007-07-12 |
Foreign References:
| JP2012138397A | 2012-07-19 | |||
| JPH08139446A | 1996-05-31 | |||
| JP2006196481A | 2006-07-27 | |||
| JPH08148823A | 1996-06-07 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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