Title:
ELECTRONIC DEVICE COMPRISING HOUSING, AND HOUSING MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/164096
Kind Code:
A1
Abstract:
Various embodiments of the present invention relate to an electronic device comprising a housing and a method for manufacturing the housing, the housing forming the exterior of the electronic device, wherein the housing includes: a non-conductive injection-molded material containing a non-conductive segment part protruding from at least a part of an area; a conductive deposition layer arranged on the upper surface of the non-conductive injection-molded material that excludes the upper part of the non-conductive segment part; and a decoration layer formed on the upper part of the conductive deposition layer so as to be lightweight and perform the functions of an antenna radiator. Various other embodiments are possible.
Inventors:
LEE YOONHEE (KR)
HWANG HANGYU (KR)
IM JUNGHYUN (KR)
HWANG HANGYU (KR)
IM JUNGHYUN (KR)
Application Number:
PCT/KR2022/000726
Publication Date:
August 04, 2022
Filing Date:
January 14, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/02; H01Q1/24; H04M1/02; H05K5/00
Foreign References:
| KR101609375B1 | 2016-04-05 | |||
| KR101300953B1 | 2013-08-27 | |||
| KR20160094155A | 2016-08-09 | |||
| KR101137988B1 | 2012-04-20 | |||
| KR102163406B1 | 2020-10-08 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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