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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE
Document Type and Number:
WIPO Patent Application WO/2021/080341
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present invention comprises: a housing comprising a first plate disposed to face a first direction, a second plate disposed to face a second direction opposite to the first direction, and a lateral surface member, which is disposed to face a third direction perpendicular to the first and second directions, encompasses at least a part of the space between the first and second plates, and has at least one microphone hole; a printed circuit board disposed between the first and second plates; a microphone module coupled to one surface of the printed circuit board facing the first direction, and disposed to be adjacent to the lateral surface member; and a microphone sound path for connecting sound from the microphone hole to the microphone module, wherein the microphone sound path can include an opening formed in the one surface of the printed circuit board facing the microphone module and extended toward the microphone hole. Other various embodiments are possible.

Inventors:
HAN BRIAN (KR)
SUNG MINCHUL (KR)
Application Number:
PCT/KR2020/014474
Publication Date:
April 29, 2021
Filing Date:
October 22, 2020
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04R1/08; G06F1/16; H04R1/28
Foreign References:
US20140065890A12014-03-06
KR20150025340A2015-03-10
KR20130077743A2013-07-09
KR100936169B12010-01-12
KR20140050912A2014-04-30
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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