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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD WITH SLITS
Document Type and Number:
WIPO Patent Application WO/2020/149588
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present invention comprises a printed circuit board formed of a stacked structure of a plurality of substrates, and may comprise, among the plurality of stacked substrates: a first circuit board including a ground surface formed on at least a partial surface, a slit formed in at least a partial area of the ground surface, and at least one ground bridge structure traversing the slit; and a second circuit board including at least one high-speed signal line of which at least a portion is disposed to overlap therewith over or under the ground bridge structure.

Inventors:
OH NAMSEOK (KR)
SHIM MINKYU (KR)
KIM HYUNJAE (KR)
Application Number:
PCT/KR2020/000562
Publication Date:
July 23, 2020
Filing Date:
January 13, 2020
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02
Domestic Patent References:
WO2018128120A12018-07-12
Foreign References:
JP2018101682A2018-06-28
JP2010050298A2010-03-04
JP2016076540A2016-05-12
US20160133532A12016-05-12
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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