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Patent Searching and Data


Title:
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/045409
Kind Code:
A1
Abstract:
An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.

Inventors:
JUNG CHUNGHYO (KR)
Application Number:
PCT/KR2020/011024
Publication Date:
March 11, 2021
Filing Date:
August 19, 2020
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H05K9/00
Domestic Patent References:
WO2019164367A12019-08-29
Foreign References:
KR20180094831A2018-08-24
US20180233428A12018-08-16
JP2005064266A2005-03-10
CN105873417A2016-08-17
US20170367175A12017-12-21
US9877380B22018-01-23
EP3255967A12017-12-13
Other References:
See also references of EP 3964041A4
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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