Title:
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/045409
Kind Code:
A1
Abstract:
An electronic device according to various embodiments may include: a circuit board; an electrical element disposed on an upper surface of the circuit board; a shield can surrounding at least a portion of the electrical element and having a first opening provided through a portion of the shield can facing the electrical element; a shielding sheet including a shielding layer disposed on at least a portion of the shield can and a support layer disposed on an upper surface of the shielding layer and including a second opening corresponding to the first opening; and a first heat transfer member comprising a heat dissipating material having at least a portion disposed inside the second opening and at least one surface in contact with the shielding layer.
More Like This:
JP6615630 | Electrical equipment |
JP2578547 | [Name of device] Mounting bracket |
JP2012028484 | MODULE AND MANUFACTURING METHOD OF THE SAME |
Inventors:
JUNG CHUNGHYO (KR)
Application Number:
PCT/KR2020/011024
Publication Date:
March 11, 2021
Filing Date:
August 19, 2020
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H05K9/00
Domestic Patent References:
WO2019164367A1 | 2019-08-29 |
Foreign References:
KR20180094831A | 2018-08-24 | |||
US20180233428A1 | 2018-08-16 | |||
JP2005064266A | 2005-03-10 | |||
CN105873417A | 2016-08-17 | |||
US20170367175A1 | 2017-12-21 | |||
US9877380B2 | 2018-01-23 | |||
EP3255967A1 | 2017-12-13 |
Other References:
See also references of EP 3964041A4
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: