Title:
ELECTRONIC DEVICE INCLUDING SENSOR
Document Type and Number:
WIPO Patent Application WO/2019/164332
Kind Code:
A1
Abstract:
An electronic device is provided. The electronic device includes a fingerprint sensor including a sensor having a surface including epoxy molding compound (EMC) resin, a first layer disposed on the surface of the sensor or above the surface of the sensor, and a second layer disposed on the first layer or above the first layer. The first layer includes a first ultraviolet (UV) hardening material having first hardness. The second layer includes a second UV hardening material having second hardness greater than the first hardness and a surface of the second layer has surface roughness less than a specified value.
Inventors:
HWANG BYUNGSEON (KR)
LEE DEOKHEE (KR)
LEE SUNGGYU (KR)
LEE DEOKHEE (KR)
LEE SUNGGYU (KR)
Application Number:
PCT/KR2019/002207
Publication Date:
August 29, 2019
Filing Date:
February 22, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06K9/00; H01L23/28; H01L27/146
Foreign References:
| KR101758249B1 | 2017-07-17 | |||
| KR20130050249A | 2013-05-15 | |||
| JP2005209431A | 2005-08-04 | |||
| KR20170094059A | 2017-08-17 | |||
| JP2007219013A | 2007-08-30 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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