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Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/033007
Kind Code:
A1
Abstract:
Provided is an electronic device comprising: a wiring board that has a mounting surface; a grounding electrode that defines a grounding region on the mounting surface; an electronic component that is disposed on the mounting surface and in the grounding region; an insulating protective layer that is disposed in the grounding region and covers the electronic component; and an electromagnetic shielding layer that is provided across both the insulating protective layer and the grounding electrode, covers the insulating protective layer and is electrically connected to the grounding electrode, and is a solidified product of ink for forming an electromagnetic shielding layer, wherein a porosity S1 that is the porosity of the electromagnetic shielding layer in a section positioned on the grounding electrode is lower than a porosity S2 that is the porosity of the electromagnetic shielding layer in a section positioned on the insulating protective layer. Also provided is a manufacturing method therefor.

Inventors:
FUJII YUSUKE (JP)
Application Number:
PCT/JP2022/032678
Publication Date:
March 09, 2023
Filing Date:
August 30, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K1/02; C09D11/30; H01L23/28; H05K3/28; H05K9/00
Domestic Patent References:
WO2016052225A12016-04-07
Foreign References:
JP2019091866A2019-06-13
JP2018060990A2018-04-12
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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