Title:
ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/019184
Kind Code:
A1
Abstract:
Provided is an electronic device manufacturing method by which a void is less likely to occur in a sealing material even when a gap between electrodes of a mounting component of the electronic device and a gap between a base material and the mounting component are reduced. The electronic device (1) manufacturing method comprises a mounting step, an injection step, and a sealing step. In the mounting step, a mounting component (3) is surface-mounted on a base material (2) via a plurality of electrodes (33). In the injection step, a thermosetting sealing resin composition is injected between the base material (2) and the mounting component (3). In the sealing step, the sealing resin component is cured to produce a sealing material (4). In the sealing step, the sealing resin composition is heated under pressure and thus cured. The shortest pitch between the plurality of electrodes (33) is 100 μm or less, and a gap between the base material (2) and the mounting component (3) is 25 μm or less.
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Inventors:
KISANUKI ATSUSHI
OOHASI HIKARU
MAEDA YASUAKI
OOHASI HIKARU
MAEDA YASUAKI
Application Number:
PCT/JP2021/026395
Publication Date:
January 27, 2022
Filing Date:
July 14, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/18; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP2018142611A | 2018-09-13 | |||
| JP2013077855A | 2013-04-25 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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