Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/039149
Kind Code:
A1
Abstract:
An electronic device (1) is provided with: a wiring board (5); a piezoelectric element (7) (electronic component) installed so that the functional surface (19a) (principal surface) faces the upper surface (11a) (obverse surface) of the wiring board (5); and a resin section (9) for sealing the space (S) across which the upper surface (11a) of the wiring board (5) and the functional surface (19a) of the piezoelectric element (7) face each other, the resin section being bonded to the wiring board (5) and the side surface (19c) of the piezoelectric element (7). The resin section (9) is concave with respect to the space (S).

Inventors:
OIKAWA AKIRA (JP)
Application Number:
PCT/JP2012/073470
Publication Date:
March 21, 2013
Filing Date:
September 13, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
OIKAWA AKIRA (JP)
International Classes:
H01L23/08; H01L23/20; H03H9/25
Foreign References:
JP2007073554A2007-03-22
JP2002290199A2002-10-04
JP2004039945A2004-02-05
JP2000004139A2000-01-07
JP2004215218A2004-07-29
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Download PDF:
Claims: