Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195834
Kind Code:
A1
Abstract:
Provided is an electronic device comprising: an upper package (10) comprising an upper chip (10a); a lower package (12) comprising a lower chip (12a); a printed circuit board (16) comprising the upper package and the lower package stacked on the upper part thereof; and a thermal diffusion layer (26, 30) positioned in the lower package near the lower chip.
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Inventors:
KUNIEDA HIROYOSHI (JP)
HAYASHI HIROKI (JP)
HAYASHI HIROKI (JP)
Application Number:
PCT/JP2020/010547
Publication Date:
October 01, 2020
Filing Date:
March 11, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L23/29; H01L23/36; H01L25/10; H01L25/11; H01L25/18
Foreign References:
| US20140133105A1 | 2014-05-15 |
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
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