Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/090785
Kind Code:
A1
Abstract:
Provided is an electronic device capable of holding, with high positional accuracy, an electronic element on a metal wiring pattern formed on a deformable base material and maintaining electrical bondage by suppressing melting and flowing out of a joining means for conductively joining the electronic element to the metal wiring pattern, due to heat and pressure. This electronic device is provided with: a deformable base material; a metal wiring pattern disposed on the base material; an electronic element joined to the metal wiring pattern by a joining means which includes a thermally-fusible conductive component; a resin layer that covers one surface of the base material on which the metal wiring pattern is disposed; and a resin cover layer that has a higher softening point than the resin layer and that covers a part or the entirety of the joining means so as to be separated from the resin layer.
Inventors:
SUGIMOTO MASAAKI (JP)
NOBORIGUCHI SHORI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
NOBORIGUCHI SHORI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
Application Number:
PCT/JP2020/040995
Publication Date:
May 14, 2021
Filing Date:
October 31, 2020
Export Citation:
Assignee:
ELEPHANTECH INC (JP)
TAKAHATA PREC CO LTD (JP)
TAKAHATA PREC CO LTD (JP)
International Classes:
H01L23/32; H05K1/02; H05K3/28
Domestic Patent References:
| WO2019198404A1 | 2019-10-17 |
Foreign References:
| JP2010067773A | 2010-03-25 | |||
| JP2016062768A | 2016-04-25 | |||
| JPH08288037A | 1996-11-01 |
Attorney, Agent or Firm:
SEZAKI Yukinori (JP)
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