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Patent Searching and Data


Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117344
Kind Code:
A1
Abstract:
The present invention comprises: a printed wiring substrate on which at least one insulating layer and a plurality of wiring layers are layered; a housing inside of which at least the printed wiring substrate is disposed; a heat-generating element which is mounted on the printed wiring substrate and generates heat during driving; and a connector mounted on the printed wiring substrate and formed from a material having heat dissipating characteristics. The printed wiring substrate has a first wiring layer, a first insulating layer, and a second wiring layer which are layered in this order from the outside in the thickness direction, and the first wiring layer and the second wiring layer are at least partially connected. The thickness of the second wiring layer is made to be greater than the thickness of the first wiring layer, and a part of the connector is connected to the second wiring layer.

Inventors:
YAMADA MOTONARI (JP)
Application Number:
PCT/JP2020/039287
Publication Date:
June 17, 2021
Filing Date:
October 19, 2020
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
G03B17/55; H01R13/46; H04N5/225; H05K1/02
Foreign References:
JPH1093237A1998-04-10
JP6612008B12019-11-27
JP2011124386A2011-06-23
Attorney, Agent or Firm:
IWATA, Masanobu et al. (JP)
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