Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/059558
Kind Code:
A1
Abstract:
An elastic surface wave device (10) according to the present embodiment comprises: an elastic surface wave element (2) in which a functional element and a bump (21) are formed on one main surface; a substrate (1) on which the elastic surface wave element (2) having the bump (21) is mounted using the bump (21) as a joining portion; a frame (3) that is disposed on the substrate (1) around the elastic surface wave element (2) when the elastic surface wave element (2) mounted on the substrate (1) is viewed in a plan view; and a sealing material (4) that seals the elastic surface wave element (2) and seals a gap between the frame and the electronic component. The frame (3) has a recess (5) in at least one location on a side of the elastic surface wave element (2).
Inventors:
SUEMORI YOSHIHARU (JP)
Application Number:
PCT/JP2021/032820
Publication Date:
March 24, 2022
Filing Date:
September 07, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H01L21/60; H01L23/28; H01L23/29; H01L23/31; H03H9/25
Foreign References:
| JP2005086615A | 2005-03-31 | |||
| JP2008072617A | 2008-03-27 | |||
| JP2006120981A | 2006-05-11 | |||
| JP2005286917A | 2005-10-13 | |||
| JP2004039945A | 2004-02-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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