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Patent Searching and Data


Title:
ELECTRONIC ELEMENT ASSEMBLY PACKAGE, CIRCUIT BOARD FOR ELECTRONIC ELEMENT MODULE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/263018
Kind Code:
A1
Abstract:
Provided are an electronic element assembly package, a circuit board for an electronic element module, and a method for manufacturing same. The electronic element assembly package, according to one embodiment of the present invention, comprises: a circuit board; an electronic element mounted on the circuit board; and a driving element that drives the electronic element, wherein, the circuit board may comprise: a core layer in which wiring layers are stacked, the wiring layers including at least one via that transmits an electrical input/output signal of the electronic element or the driving element or collects heat generated from the electronic element or the driving element; and at least one through via that is connected to the via of the core layer so as to relay the electrical input/output signal or dissipate the collected heat to the outside.

Inventors:
CHUNG YEON SOO (KR)
AHN JOO-HWAN (KR)
Application Number:
PCT/KR2020/008368
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
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Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01L31/12; H01L23/14; H01L23/367; H01L23/48; H01L23/525; H01L23/528; H01L23/538; H01L23/552; H01L25/065
Foreign References:
KR20140070655A2014-06-10
US20160105241A12016-04-14
KR20150094669A2015-08-19
KR20180032985A2018-04-02
US20060030084A12006-02-09
Attorney, Agent or Firm:
KIM, Kwonseok (KR)
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