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Title:
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/189612
Kind Code:
A1
Abstract:
This electronic element mounting substrate has: a rectangular first substrate having a first main surface, and one or a plurality of mounting parts for an electronic element, which is/are a longitudinal area located on the first main surface, and a second main surface on a side opposite to the first main surface; a rectangular second substrate located on a second main surface, formed of metal, having a third main surface facing the second main surface, and having a fourth main surface on a side opposite to the third main surface; and a plurality of heat dissipaters located on the inner side of the second substrate, formed of a carbon material, having a fifth main surface located on the third main surface side in the thickness direction, and having a sixth main surface on a side opposite to the fifth main surface, wherein in a plane perspective view, the plurality of heat dissipaters have greater heat conduction in a direction that is perpendicular to the longitudinal direction of one or a plurality of mounting parts and a direction along opposite edges of the second substrate than heat conduction in the longitudinal direction of the one or the plurality of mounting parts and the direction along the opposite edges of the second substrate.

Inventors:
MORITA YUKIO (JP)
KITAZUMI NOBORU (JP)
MORIYAMA YOUSUKE (JP)
Application Number:
PCT/JP2019/013685
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01L23/36
Foreign References:
JP2016157928A2016-09-01
JP2011159662A2011-08-18
JPH08191121A1996-07-23
JP2012238733A2012-12-06
JP2013175508A2013-09-05
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