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Patent Searching and Data


Title:
ELECTRONIC EQUIPMENT HOUSING, METHOD FOR MANUFACTURING SAME, AND METAL-RESIN COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2020/218277
Kind Code:
A1
Abstract:
Provided is an electronic equipment housing in which a metal member and an antenna cover made of plastic are integrally joined by insert molding. In this electronic equipment housing, the plastic antenna cover is a molded body of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm of 250°C or higher.

Inventors:
TOMINAGA TAKAHIRO (JP)
MORIMOTO KAI (JP)
KIMURA KAZUKI (JP)
MAKIGUCHI WATARU (JP)
UEDA KOSUKE (JP)
Application Number:
PCT/JP2020/017156
Publication Date:
October 29, 2020
Filing Date:
April 21, 2020
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B21D47/04; B21D53/00; B29C45/14; H05K5/02
Domestic Patent References:
WO2018056433A12018-03-29
Foreign References:
JP2017199803A2017-11-02
JP2010282493A2010-12-16
JP2010080515A2010-04-08
US20160079663A12016-03-17
JP2006346980A2006-12-28
JP2010282493A2010-12-16
JP2011156587A2011-08-18
JP2019080746A2019-05-30
Other References:
KURIMOTO TECHNICAL REPORT, no. 64
See also references of EP 3960325A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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