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Patent Searching and Data


Title:
ELECTRONIC MODULE, METHOD FOR MANUFACTURING ELECTRONIC MODULE, AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2021/186519
Kind Code:
A1
Abstract:
This electronic module comprises an electronic module 50 having a cavity portion 55 in which a bottom surface 52 and walls 51a to 51d are formed, and a plurality of electronic components 61, 62, 63 mounted on electrodes provided on the bottom surface 52, wherein the walls 51a, 51b in a direction in which the plurality of electronic components are arrayed are inclined with respect to the bottom surface 52.

Inventors:
YAMADA JUNYA (JP)
MOTOHARA HIROYUKI
Application Number:
PCT/JP2020/011566
Publication Date:
September 23, 2021
Filing Date:
March 16, 2020
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L23/02; A61B1/00; A61B1/04; H01L27/146; H04N5/225; H05K1/02; H05K1/18; H05K3/00
Domestic Patent References:
WO2013031276A12013-03-07
WO2015133442A12015-09-11
Foreign References:
JP2008124923A2008-05-29
JP2006295038A2006-10-26
JPH10209413A1998-08-07
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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