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Patent Searching and Data


Title:
ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/261969
Kind Code:
A1
Abstract:
The present disclosure provides an electronic module that can suppress a decrease in the joining strength of a lead with respect to a wiring board. The electronic module (1) comprises: a wiring board (2) that has, on a lower surface (2b) thereof, a second electrode pad (12) having a joint surface (12a); a lead (4) that is electrically connected to the second electrode pad (12) via a solder (24); and a sealing body (5) that seals the lead (4). The lead (4) has: an exposure part (21) exposed to the outside of the sealing body (5); and a body part (22) extending from the exposure part (21) to the wiring board (2) and including a tip part (23) on the wiring board (2) side, wherein the tip part (23) is connected to the second electrode pad (12) through the solder (24). A tip surface (23a) of the tip part (23) is formed such that the thickness of the solder (24) between the tip surface (23a) and the joint surface (12a) of the second electrode pad (12) in a direction orthogonal to the joint surface (12a) is non-uniform.

Inventors:
YASUNAGA SHOJI (JP)
Application Number:
PCT/JP2020/022599
Publication Date:
December 30, 2020
Filing Date:
June 09, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/50
Foreign References:
JP2011040602A2011-02-24
JP2014239379A2014-12-18
JP2005093872A2005-04-07
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
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