Title:
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/196351
Kind Code:
A1
Abstract:
An embedded chip package (100) and a manufacturing method therefor. The chip package (100) comprises at least one chip (140) and a frame (110) surrounding the at least one chip (140), wherein the chip (140) is provided with a terminal face (141) and a back face (142), which are separated by the height of the chip (140), the height of the frame (110) is equal to or greater than the height of the chip (140), a gap between the chip (140) and the frame (110) is completely filled with a photosensitive polymer dielectric material (160), the terminal face (141) of the chip (140) is coplanar with the frame (110), a first wiring layer (131) is arranged on the terminal face (141) of the chip (140), and a second wiring layer (132) is arranged on the back face (142) of the chip (140).
Inventors:
CHEN XIANMING (CN)
FENG JINDONG (CN)
HUANG BENXIA (CN)
FENG LEI (CN)
WANG WENSHI (CN)
FENG JINDONG (CN)
HUANG BENXIA (CN)
FENG LEI (CN)
WANG WENSHI (CN)
Application Number:
PCT/CN2020/089735
Publication Date:
October 07, 2021
Filing Date:
May 12, 2020
Export Citation:
Assignee:
ZHUHAI ACCESS SEMICONDUCTOR CO LTD (CN)
International Classes:
H01L23/29
Foreign References:
| CN111554639A | 2020-08-18 | |||
| US20160307847A1 | 2016-10-20 | |||
| CN110867417A | 2020-03-06 | |||
| US20190035758A1 | 2019-01-31 | |||
| CN110858548A | 2020-03-03 | |||
| CN106997870A | 2017-08-01 |
Attorney, Agent or Firm:
BEIJING FORESTSONG PATENT AGENCY CO., LTD. (CN)
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