Title:
EMBOSSING DEVICE AND EMBOSSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/031159
Kind Code:
A1
Abstract:
In this embossing device (10), an embossing roll (20) has a rugged molding part (22) on the outer circumference thereof. A first backup roll (24), together with the embossing roll (20), takes in and pinches a base material (85). First heating parts (60) heat the first backup roll (24). A second backup roll (26), together with the embossing roll (20), takes in and pinches the base material (85). A contact part (30) is disposed in a first range (R1) so as to face the embossing roll (20). The contact part (30) comes into contact with the rear surface of the base material (85).
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Inventors:
YOSHIMURA MASARU (JP)
Application Number:
PCT/JP2018/026482
Publication Date:
February 14, 2019
Filing Date:
July 13, 2018
Export Citation:
Assignee:
SEIREN CO LTD (JP)
International Classes:
B29C59/04; B31F1/07
Foreign References:
JP2007261202A | 2007-10-11 | |||
JP2007098742A | 2007-04-19 | |||
JPS55111224A | 1980-08-27 | |||
JP2009050538A | 2009-03-12 | |||
JP2002086562A | 2002-03-26 | |||
JP2016159476A | 2016-09-05 |
Attorney, Agent or Firm:
KITAGAWA, Yasutaka (JP)
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