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Patent Searching and Data


Title:
ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/049645
Kind Code:
A1
Abstract:
This encapsulating material for compression molding contains an epoxy resin, a curing agent, and an inorganic filler, wherein, in the image that is obtained when this encapsulating material for compression molding is compression-molded on a substrate via a silicon chip and the resultant compression-molded body is observed using an ultrasonic flaw detector, it is found that the surface area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is at least 86% of the surface area of the entire region corresponding to the compression-molded body on the chip.

Inventors:
KANG DONGCHUL (JP)
OKUBO SEIGO (JP)
Application Number:
PCT/JP2020/034575
Publication Date:
March 18, 2021
Filing Date:
September 11, 2020
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
H01L23/29; B29C43/18; C08K9/06; C08L63/00; H01L23/31
Domestic Patent References:
WO2011064964A12011-06-03
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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