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Patent Searching and Data


Title:
ENCAPSULATING RESIN COMPOSITION FOR LED DISPLAY SCREEN SMT DISCRETE DEVICE AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/238261
Kind Code:
A1
Abstract:
The present invention discloses an encapsulating resin composition for LED display screen SMT discrete device and an application thereof, the composition comprises a first-type epoxy resin, a second-type epoxy resin, anhydride, inorganic oxide microbeads, organic polymer particles and melanin. The encapsulating resin composition of the present invention can be applied to a SMT discrete RGB device for display screen, the device comprises a five-sided light-emitting independent light source containing a set of R, G and B chips, and also comprises a modular light source (4in1) containing four sets of RGB chips. The encapsulating composition of the present invention is applied to encapsulating of the above device, moisture resistance, uniformity of light emission and contrast of the device can be improved, and warpage generated during the encapsulating process is reduced. The encapsulating resin composition also has a low light attenuation characteristic for the blue light source in the RGB device, thus prolonging service life of the RGB device.

Inventors:
TAN XIAOHUA (CN)
YU HUIYUN (CN)
SHAN QIUJU (CN)
SUN XUJUN (CN)
FENG YAKAI (CN)
Application Number:
PCT/CN2020/072357
Publication Date:
December 03, 2020
Filing Date:
January 16, 2020
Export Citation:
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Assignee:
TECORE SYNCHEM INC (CN)
International Classes:
C09J11/04; C09J163/00; C09J11/08
Foreign References:
CN110282561A2019-09-27
CN101273089A2008-09-24
CN105518882A2016-04-20
CN109243313A2019-01-18
CN104893247A2015-09-09
CN107779150A2018-03-09
EP0441622A11991-08-14
Attorney, Agent or Firm:
SHANGHAI WEICE INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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