Title:
ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/078071
Kind Code:
A1
Abstract:
The embodiments of the present application relate to the field of electronics. Disclosed are an encapsulation structure and an encapsulation method. The present application comprises a substrate, and solder balls arranged on the substrate. The substrate comprises a first region and a second region where the solder balls are arranged, and the solder balls are arranged on the first region at a first distance, and are arranged on the second region at a second distance, wherein the first distance is greater than the second distance.
Inventors:
GUO TAO (CN)
Application Number:
PCT/CN2020/121524
Publication Date:
April 29, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01L23/488
Foreign References:
| CN210167352U | 2020-03-20 | |||
| CN111213234A | 2020-05-29 | |||
| CN110797321A | 2020-02-14 | |||
| JP2001068594A | 2001-03-16 | |||
| CN101719486A | 2010-06-02 | |||
| US20020195722A1 | 2002-12-26 | |||
| US7652361B1 | 2010-01-26 | |||
| CN101855734A | 2010-10-06 | |||
| US20100123244A1 | 2010-05-20 | |||
| CN1815726A | 2006-08-09 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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