Title:
EPOXY RESIN COMPOSITION, CIRCUIT BOARD, AND METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/087463
Kind Code:
A1
Abstract:
The present invention provides: a circuit board obtained using an epoxy resin composition that can have a satisfactory level of low-shrinkage rate after being cured, and can be used to obtain a circuit board having less warpage and excellent reliability;; and a method for producing the circuit board. The epoxy resin composition comprises, as essential components, (A) an epoxy resin, (B) an inorganic filler, (C) (meth)acrylic acid alkyl ester polymer beads, (D) an acid anhydride, and (E) a curing accelerator. This circuit board is obtained using the epoxy resin composition. This method is for producing the circuit board.
Inventors:
WATANABE KOZO (JP)
Application Number:
PCT/JP2018/025297
Publication Date:
May 09, 2019
Filing Date:
July 04, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C08L63/00; C08G59/42; C08K3/36; C08K5/1539; C08L33/06; H01L23/29; H01L23/31
Foreign References:
| JP2017071707A | 2017-04-13 | |||
| JP2000007889A | 2000-01-11 | |||
| JP2005350647A | 2005-12-22 | |||
| JP2001214040A | 2001-08-07 | |||
| JP2015000888A | 2015-01-05 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
Download PDF: