Title:
EPOXY RESIN COMPOSITION, AND HEAT DISSIPATION CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/054527
Kind Code:
A1
Abstract:
The present invention relates to: an epoxy resin composition which has a thermal conductivity of at least 5 W/m·k and thus a sufficient heat dissipation effect when used to form a multilayer circuit, and can replace ceramic substrates used in automobiles, home appliances, electric vehicles, or the like; and a heat dissipation circuit board using same. An epoxy resin composition according to one embodiment of the present invention includes an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler may include at least 85 wt% of alumina and aluminum nitride particles having a maximum particle diameter of less than 32 μm. The epoxy resin composition can form an insulating layer including the inorganic filler, which has an average particle diameter of less than 1.0 μm, and having excellent thermal conductivity and excellent withstand voltage characteristics, and thus provide a heat dissipation circuit board that is superior to existing single layer circuit boards and has high heat dissipation.
Inventors:
SUNG SOO-HYUN (KR)
LEE NAE-WON (KR)
LEE JIN-PYO (KR)
LEE NAE-WON (KR)
LEE JIN-PYO (KR)
Application Number:
PCT/KR2019/016557
Publication Date:
March 25, 2021
Filing Date:
November 28, 2019
Export Citation:
Assignee:
ELEFANT INC (KR)
International Classes:
C08K3/22; C08K3/28; C08K7/18; C08L15/00; C08L63/00; C08L83/04; H05K1/02; H05K1/03
Foreign References:
| JP2014037536A | 2014-02-27 | |||
| KR20150025319A | 2015-03-10 | |||
| JP2002076549A | 2002-03-15 | |||
| JP2007021763A | 2007-02-01 | |||
| JPH0461193A | 1992-02-27 |
Attorney, Agent or Firm:
IPUS PATENT & LAW FIRM (KR)
Download PDF:
Previous Patent: NANOPARTICLES WITH SPECIAL COATING AND USE THEREOF
Next Patent: WASTE COMBUSTION DEVICE
Next Patent: WASTE COMBUSTION DEVICE