Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/262061
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition: that produces a cured product having excellent adhesion with a metal while having low dielectric properties; that has good workability when used; and that and good shelf life. More specifically, provided is an epoxy resin composition containing a specific epoxy resin and a specific phenol-based curing agent.
Inventors:
HARISAKI RYOTA (JP)
YAMAMOTO KATSUMASA (JP)
YAMAMOTO KATSUMASA (JP)
Application Number:
PCT/JP2020/023355
Publication Date:
December 30, 2020
Filing Date:
June 15, 2020
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/20; C08G59/62; C08K3/22; C08K3/36; C08L63/00; C09D7/61; C09D163/00; C09J11/04; C09J163/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2018131567A1 | 2018-07-19 |
Foreign References:
| JP2016069548A | 2016-05-09 | |||
| JP2012001668A | 2012-01-05 | |||
| US3445483A | 1969-05-20 | |||
| JP2019048906A | 2019-03-28 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Download PDF: