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Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/192559
Kind Code:
A1
Abstract:
[Problem] To provide an epoxy resin composition attaining excellent flexibility and having low curing shrinkage. [Solution] The epoxy resin composition comprises the following (A) to (E) components. Component (A): a compound having two or more epoxy groups Component (B): a phenyl monoglycidyl ether having an alkyl group having 1-10 carbon atoms Component (C): an oxetane compound Component (D): a thiol hardener Component (E): a curing accelerator

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Inventors:
IWASAWA JYUNYA (JP)
MIHASHI KOUKI (JP)
Application Number:
PCT/JP2021/002001
Publication Date:
September 30, 2021
Filing Date:
January 21, 2021
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08G59/50; C08G59/66
Domestic Patent References:
WO2018047597A12018-03-15
WO2020044964A12020-03-05
Foreign References:
JP2019156965A2019-09-19
JP2012236972A2012-12-06
JP2009040989A2009-02-26
JP2016514738A2016-05-23
JP2018172494A2018-11-08
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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