Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/026872
Kind Code:
A1
Abstract:
A problem addressed by the present invention is to provide a resin composition, an adhesive, or a sealing material that gives a cured product having reworkability at a specific temperature that does not have a thermal effect on parts. The present invention provides an epoxy resin composition that includes (A) a trifunctional or higher thiol compound, (B) a polyfunctional epoxy compound, (C) a monofunctional epoxy compound, and (D) a curing catalyst. Component (A) includes an ester-bond-free polyfunctional thiol compound and the ratio ([number of epoxy equivalents of component (C)]/[ number of thiol equivalents of component (A)]) of the number of epoxy equivalents of component (C) to the number of thiol equivalents of component (A) is from more than 0.50 to less than 0.60.
Inventors:
NEGISHI YUTA (JP)
SAITO ATSUSHI (JP)
SAITO ATSUSHI (JP)
Application Number:
PCT/JP2022/030727
Publication Date:
March 02, 2023
Filing Date:
August 12, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/06; C08G59/66; C09J11/00; C09J163/00; H01L23/29; H01L23/31; H01L27/146
Domestic Patent References:
| WO2021033327A1 | 2021-02-25 |
Foreign References:
| JP2021031666A | 2021-03-01 | |||
| JP2019156965A | 2019-09-19 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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